JPS59159593A - 金属プリント基板の製造方法 - Google Patents
金属プリント基板の製造方法Info
- Publication number
- JPS59159593A JPS59159593A JP3382983A JP3382983A JPS59159593A JP S59159593 A JPS59159593 A JP S59159593A JP 3382983 A JP3382983 A JP 3382983A JP 3382983 A JP3382983 A JP 3382983A JP S59159593 A JPS59159593 A JP S59159593A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- printed circuit
- circuit board
- lead wire
- aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 title claims description 33
- 239000002184 metal Substances 0.000 title claims description 33
- 238000000034 method Methods 0.000 title claims description 14
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 39
- 238000004519 manufacturing process Methods 0.000 claims description 23
- 239000011347 resin Substances 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 20
- 238000005553 drilling Methods 0.000 claims description 16
- 238000003825 pressing Methods 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 description 42
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 42
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 19
- 239000011889 copper foil Substances 0.000 description 14
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 229910052742 iron Inorganic materials 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000008346 aqueous phase Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000002262 irrigation Effects 0.000 description 1
- 238000003973 irrigation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3382983A JPS59159593A (ja) | 1983-03-03 | 1983-03-03 | 金属プリント基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3382983A JPS59159593A (ja) | 1983-03-03 | 1983-03-03 | 金属プリント基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59159593A true JPS59159593A (ja) | 1984-09-10 |
| JPH0358199B2 JPH0358199B2 (en]) | 1991-09-04 |
Family
ID=12397369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3382983A Granted JPS59159593A (ja) | 1983-03-03 | 1983-03-03 | 金属プリント基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59159593A (en]) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5623796A (en) * | 1979-07-31 | 1981-03-06 | Matsushita Electric Works Ltd | Method of manufacturing substrate for ic |
-
1983
- 1983-03-03 JP JP3382983A patent/JPS59159593A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5623796A (en) * | 1979-07-31 | 1981-03-06 | Matsushita Electric Works Ltd | Method of manufacturing substrate for ic |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0358199B2 (en]) | 1991-09-04 |
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